Photoneo technology at Warsaw Pack
Come to see the latest packaging technologies at the Warsaw Pack trade fair! The expo is open until 28 April, 4 PM.
Thanks to our partner ASTOR, you can see a perfect blend of our 3D vision technology with robotic intelligence to enable automated depalletization of boxes with absolute precision and reliability.
Stop by to discuss your projects and how you can achieve higher productivity through advanced automation.
We’re looking forward to meeting you there!