Mitsubishi Bin Picking solution from Photoneo: Complete Bin Picking solution for Mitsubishi robots is now presenting on Packaging Innovations in Warsaw Poland. Thanks to our partner MV Center Poland (http://www.mv-center.pl).
Photoneo products grabbed visitors attention on Automation World Korea 28~30 March. Thanks to our partner CMES (http://www.cmes.kr/).
Meet us @ Hall 4A – Stand 4A-518 (NVIDIA booth) at embedded world Conference 2017 14.-16.3.2017, Nuremberg, Germany. We will be presenting our state of the art PhoXi 3D scanner with embeded NVIDIA TX1 module.
Jan Zizka (CEO) and Vincent Touquet (Head of Strategic Partnerships) presented Photoneo Bin Picking product and vision on Mobility.Pioneers in Munich.
Tomas our CTO was selected by Forbes among 30 brightest young entrepreneurs, innovators and game changers in Industry segment. If you would like to know more, here is the link: Forbes 30 under 30.
The industrial PhoXi 3D Scanner Model L in production process of chair packaging. (Integration by M-D-J spol. s r.o. with their Spaceye system. Installation for KOVONA SYSTEM www.kovona-karvina.cz)
We are pleased to announce that Photoneo and ARGO CORPORATION (www.argocorp.com) have sealed the deal on distributing Photoneo products in Japan.
Vision Show – we would like to thank to all of you for your visit at our booth. It was our pleasure to answer your questions and to show you how our products work. We’ll always strive to enVISION a technological progress and utilize our human potential to bring it to you.
Visit us at our booth at Vision 2016 and have a hands-on experience with our scanners and bin picking!