November 26, 2021

Advanced bin picking by Photoneo at Mecspe

Another great event focused on innovations in the manufacturing industry is successfully over and we are happy that we could be part of it. The Mecspe show took place between 23-25 November in Bologna, Italy.

Thanks to our partner Advanced Technologies SpA, visitors had a chance to see our unsurpassed 3D vision and bin picking technology firsthand and learn how they can push their own projects to the next level of automation.

If you were not able to attend the event, you can watch this nice video taken at the AT booth to see the showcase they presented – a perfect interplay of a Denso robot and our technology.

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